Materials, technology and reliability of low-k dielectrics and copper interconnectsSymposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.) · First published 2006Open the Tome
The Dispatches of Field Marshal the Duke of Wellington, K. G. During His Various Campaigns in India, Denmark, Portugal, Spain, the Low Countries, and FranceArthur Wellesley Wellington, John Gurwood · First published 2018Open the Tome
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics--2004R. J. Carter · First published 2004Open the Tome
Materials, technology and reliability for advanced interconnects and low-k dielectricsKaren Maex · First published 2001Open the Tome
Materials, Technology and Reliability of Low-K Dielectrics and Copper InterconnectsTing Y. Tsui · First published 2006Open the Tome
Copper Interconnects, New Contact Metal- Lurgies, & Low-k DielectricsG. S. Mathad · First published 2002Open the Tome
Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003Symposim E, "Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics" (2003 San Francisco, Calif.) · First published 2003Open the Tome
Low cycle fatigue behavior of polycrystalline NiAl at 300 and 1000KBradley A. Lerch · First published 1993Open the Tome
Low-pressure performance of annular, high-pressure (40-atm), high-temperature, (2480 K) combustion systemJerrold D. Wear · First published 1980Open the Tome
Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectricsSymposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics (2000 Phoenix, Ariz.) · First published 2001Open the Tome
Radiation from Ag and K films bombarded by low energy electronsM. S Chung · First published 1978Open the Tome
Pore Characterization in Low-K Dielectric Films Using X-Ray Reflectivitynist · First published 2014Open the Tome
