Smart Power IntegrationAhmed Shaker, Christian Gontrand, Mohamed Abouelatta · First published 2022Open the Tome
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects EntanglementYue Ma, Christian Gontrand · First published 2019Open the Tome
Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional CircuitsYue Ma, Christian Gontrand · First published 2019Open the Tome