Modeling, Analysis, Design and Testing for Electronics Packaging Beyond MooreHengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao · First published 2019Open the Tome
Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond MooreHengyun Zhang, Faxing Che Author, Tingyu LIn, Wensheng Zhao · First published 2019Open the Tome
