Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out TechnologyJohn H. Lau · First published 2024Open the Tome
Chiplet Design and Heterogeneous Integration PackagingJohn H. Lau · First published 2023Open the Tome
Reliability Of Rohscompliant 2d And 3d Ic InterconnectsJohn H. Lau · First published 2010Open the Tome
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesJohn H. Lau · First published 2000Open the Tome
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assembliesJohn H. Lau · First published 1997Open the Tome
Handbook of fine pitch surface mount technologyJohn H. Lau · First published 1993 · Latest edition 1994Open the Tome
Thermal stress and strain in microelectronics packagingJohn H. Lau · First published 1993Open the Tome
