Electronic Packaging Materials Science VEdwin D. Lillie, Paul S. Ho, Ralph Jaccodine, Kenneth Jackson · First published 2014Open the Tome
Materials Reliability Issues in MicroelectronicsJames R. Lloyd, Frederick G. Yost, Paul S. Ho · First published 2014Open the Tome
Silicon MaterialsJanice L. Veteran, David L. O'Meara, Veena Misra, Paul S. Ho · First published 2014Open the Tome
Electronic Packaging Materials Science VIPaul S. Ho, Kenneth A. Jackson · First published 1993Open the Tome
Electronic Packaging Materials Science V Vol. 203Ralph Jaccodine, Paul S. Ho, Kenneth Jackson · First published 1991Open the Tome
Thin films and interfacesMaterials Research Society. (1981 Boston, Mass.), Paul S. Ho, K. N. Tu · First published 1982Open the Tome